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Flexible Printed Circuit boards play
a crucial role in making high-performance electronic equipment lighter,
smaller, and thinner, while providing highly reliable circuit connection
at the same time. Our printed flexible circuit boards have been
contributing to the development and improvement of various devices
charactering the “Information Age”. Our Products have been used
on Computers, PDA's, Bar Code Scanners, Cellular Phones, Hard Drives,
Network / Telecommunications equipment, etc.
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· Base: 1mil Polyimide / 1mil Adhesive
/ ½ oz RA copper ; · Coverlay: 1mil Polyimide /
1 mil Adhesive; · Stiffener: Polyimide, Stainless Steel
(thickness: 0.15mm); · Assembly: SMT; · Drilled
Hole Size: F0.2mm · Surface treatment: immersion Ni /Au;
· Application: Cell phone with camera; |
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· Double sided single
access
· Base: 1 mil Polyimide/ 1 mil adhesive / 1 oz RA Cu;
· Coverlay: 1 mil adhesive / 1 mil Polyimide;
· Stiffener: PET (7.5mil) + 3M467;
· Surface treatment: Electroplated Ni / Au;
· Application: Printer |
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· Single Sided Single Access ·
Base: 1 mil Polyimide / 1 mil adhesive / 1 oz RA Cu; ·
Top coating: Soldermask ink · Stiffener: PET - Top Side,
3M467 + 7.4 mil PET - Bottom Side · Surface treatment:
Tin-lead plating · Application: Public phone set |
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· Single Sided Sculptured Flex ·
Flex base: ½ mil Polyimide / ½ mil adhesive / 1oz Ra
Cu · Shielding: ½ oz copper / ½ mil Polyimide
· Application: Cell phone |
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· Four layer FPC · Material: ½
oz RA Cu / ½ mil Polyimide ( 4sheets) / ½ mil adhesive;
· Dynamic Area: Air gap; · Surface treatment: Immersion
Ni / Au · Application: Cell phone with color LCD |
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· Double Sided Double Access and sculptured
flex · Material: 1oz Copper / 1mil adhesive; ·
Surface treatment: Electroplated tin/lead plating |
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· Single Sided Double Access ·
Material : 1oz Copper / 1 mil Polyimide (2sheets) · Surface
treatment: HAL |
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· Base: 1 oz Copper / 1mil Adhesive / 1mil
Polyimide · Coverlay: 1mil Polyimide / 1mil Adhesive
· Double sided tape · Surface treatment: Electro
less Ni/Au plating · Application: Cell phone key pad |
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· 4 layer FPC with air gap on dynamic area
· Material: ½ oz copper / ½ mil adhesive / ½
mil Polyimide (4sheets) · Surface treatment: Immersion
Ni/Au · Application: cell phone with color LCD |
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Copyright
© 2002 GT Technology USA, LLC |