Product
 

Flexible Printed Circuit boards play a crucial role in making high-performance electronic equipment lighter, smaller, and thinner, while providing highly reliable circuit connection at the same time. Our printed flexible circuit boards have been contributing to the development and improvement of various devices charactering the “Information Age”. Our Products have been used on Computers, PDA's, Bar Code Scanners, Cellular Phones, Hard Drives, Network / Telecommunications equipment, etc.

 
· Base: 1mil Polyimide / 1mil Adhesive / ½ oz RA copper ;
· Coverlay: 1mil Polyimide / 1 mil Adhesive;
· Stiffener: Polyimide, Stainless Steel (thickness: 0.15mm);
· Assembly: SMT;
· Drilled Hole Size: F0.2mm
· Surface treatment: immersion Ni /Au;
· Application: Cell phone with camera;
 
· Double sided single access
· Base: 1 mil Polyimide/ 1 mil adhesive / 1 oz RA Cu;
· Coverlay: 1 mil adhesive / 1 mil Polyimide;
· Stiffener: PET (7.5mil) + 3M467;
· Surface treatment: Electroplated Ni / Au;
· Application: Printer
 
· Single Sided Single Access
· Base: 1 mil Polyimide / 1 mil adhesive / 1 oz RA Cu;
· Top coating: Soldermask ink
· Stiffener: PET - Top Side, 3M467 + 7.4 mil PET - Bottom Side
· Surface treatment: Tin-lead plating
· Application: Public phone set
 
· Single Sided Sculptured Flex
· Flex base: ½ mil Polyimide / ½ mil adhesive / 1oz Ra Cu
· Shielding: ½ oz copper / ½ mil Polyimide
· Application: Cell phone
 
· Four layer FPC
· Material: ½ oz RA Cu / ½ mil Polyimide ( 4sheets) / ½ mil adhesive;
· Dynamic Area: Air gap;
· Surface treatment: Immersion Ni / Au
· Application: Cell phone with color LCD
 
· Double Sided Double Access and sculptured flex
· Material: 1oz Copper / 1mil adhesive;
· Surface treatment: Electroplated tin/lead plating
 
· Single Sided Double Access
· Material : 1oz Copper / 1 mil Polyimide (2sheets)
· Surface treatment: HAL
 
· Base: 1 oz Copper / 1mil Adhesive / 1mil Polyimide
· Coverlay: 1mil Polyimide / 1mil Adhesive
· Double sided tape
· Surface treatment: Electro less Ni/Au plating
· Application: Cell phone key pad
 
· 4 layer FPC with air gap on dynamic area
· Material: ½ oz copper / ½ mil adhesive / ½ mil Polyimide (4sheets)
· Surface treatment: Immersion Ni/Au
· Application: cell phone with color LCD
 
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